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User Story #301

closed

CUBICS - Feature #17: Thermal Characterization

Review previous PCB thermal LTSpice approximation documentation

Added by Tyler Stocking about 2 years ago. Updated about 2 years ago.

Status:
Closed
Priority:
Normal
Assignee:
Joshua Purackal
Start date:
04/04/2023
Due date:
% Done:

0%

Estimated time:
3:00 h
Subsystem:
Mechanical
Subgroup:
Success Criteria:

Description

The thermal properties of each PCB were approximated using a excel sheet. This sheet used a weighted average of the material layers within the PCB to approximate the specific heat and thermal resistance of each printed circuit board. The goal of this story is to review the previous calculator, see where it can be improved and upgrade it to support the cubics mission.

Previous Calculator (https://docs.google.com/spreadsheets/d/17l7hL06S-2D1cAp1w6UOZGU0NTJC5vqyRDtpPf66P8U/edit#gid=481641281)

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 #1

Updated by Tyler Stocking about 2 years ago

  • Project changed from CUBICS to Sprint 003
  • Status changed from New to In Progress
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 #2

Updated by Tyler Stocking about 2 years ago

  • Estimated time set to 3:00 h
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 #3

Updated by Tyler Stocking about 2 years ago

  • Assignee set to Joshua Purackal
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 #4

Updated by Tyler Stocking about 2 years ago

  • Status changed from In Progress to Closed
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